JPH01125539U - - Google Patents

Info

Publication number
JPH01125539U
JPH01125539U JP2102988U JP2102988U JPH01125539U JP H01125539 U JPH01125539 U JP H01125539U JP 2102988 U JP2102988 U JP 2102988U JP 2102988 U JP2102988 U JP 2102988U JP H01125539 U JPH01125539 U JP H01125539U
Authority
JP
Japan
Prior art keywords
polygonal columnar
columnar block
thermosetting resin
rotating
peripheral surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2102988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2102988U priority Critical patent/JPH01125539U/ja
Publication of JPH01125539U publication Critical patent/JPH01125539U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2102988U 1988-02-19 1988-02-19 Pending JPH01125539U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2102988U JPH01125539U (en]) 1988-02-19 1988-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2102988U JPH01125539U (en]) 1988-02-19 1988-02-19

Publications (1)

Publication Number Publication Date
JPH01125539U true JPH01125539U (en]) 1989-08-28

Family

ID=31237897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2102988U Pending JPH01125539U (en]) 1988-02-19 1988-02-19

Country Status (1)

Country Link
JP (1) JPH01125539U (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784141A (en) * 1980-11-14 1982-05-26 Hitachi Ltd Wire bonder
JPS59232430A (ja) * 1983-06-16 1984-12-27 Nec Corp 半導体素子の製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784141A (en) * 1980-11-14 1982-05-26 Hitachi Ltd Wire bonder
JPS59232430A (ja) * 1983-06-16 1984-12-27 Nec Corp 半導体素子の製造装置

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