JPH01125539U - - Google Patents
Info
- Publication number
- JPH01125539U JPH01125539U JP2102988U JP2102988U JPH01125539U JP H01125539 U JPH01125539 U JP H01125539U JP 2102988 U JP2102988 U JP 2102988U JP 2102988 U JP2102988 U JP 2102988U JP H01125539 U JPH01125539 U JP H01125539U
- Authority
- JP
- Japan
- Prior art keywords
- polygonal columnar
- columnar block
- thermosetting resin
- rotating
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2102988U JPH01125539U (en]) | 1988-02-19 | 1988-02-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2102988U JPH01125539U (en]) | 1988-02-19 | 1988-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01125539U true JPH01125539U (en]) | 1989-08-28 |
Family
ID=31237897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2102988U Pending JPH01125539U (en]) | 1988-02-19 | 1988-02-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01125539U (en]) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784141A (en) * | 1980-11-14 | 1982-05-26 | Hitachi Ltd | Wire bonder |
JPS59232430A (ja) * | 1983-06-16 | 1984-12-27 | Nec Corp | 半導体素子の製造装置 |
-
1988
- 1988-02-19 JP JP2102988U patent/JPH01125539U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784141A (en) * | 1980-11-14 | 1982-05-26 | Hitachi Ltd | Wire bonder |
JPS59232430A (ja) * | 1983-06-16 | 1984-12-27 | Nec Corp | 半導体素子の製造装置 |